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            About Nanya

            About Nanya

            Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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            News

            News

            Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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            Talent recruitment

            Talent recruitment

            Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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            Contact Us

            Contact Us

            Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

            Detail
            Large capacity continuous stripping and washing integrated machine

            Product Introduction

            The TAC-TCQ10K continuous debonding and insertion integrated machine is an intelligent device designed specifically for the photovoltaic industry. This device can achieve automatic debonding, continuous feeding, and fully automatic insertion of silicon wafers, without the need for manual handling. This equipment has the characteristics of high production efficiency, high yield, low labor cost, and production risk. It is suitable for various specifications of silicon wafers. The insertion program and process can be freely adjusted according to actual needs, and is equipped with functions such as chain protection, working condition display, and fault alarm.

            Performance and technical parameters
            Process characteristics
            Control system
            Fragment detection system
            Layout Plan of Insertion Machine
            Main component configuration
            Technical support and service requirements

            1. Overall specification of the degumming insert cleaning integrated machine: 31800L × 3200W × 3200H(mm)

            2. Fragmentation rate: ≤ 2 ‰ (caused by equipment itself; excluding incoming material issues and other equipment impacts)

            3. Collapse rate: ≤ 5 ‰ (caused by equipment itself; excluding incoming material issues and other equipment impacts)

            4. Lamination rate: ≤ 1 ‰ (only the number of laminations inserted into the flower basket is calculated; excluding the impact of incoming materials and other equipment)

            5. Production capacity: ≥ 13000 pieces/hour (182mm silicon wafer); ≥ 10000 pieces/hour (210mm silicon wafer)

            6. Suitable for silicon wafers: ① Types of silicon wafers: monocrystalline silicon wafers, polycrystalline silicon wafers

            ② Silicon wafer size: 182mm ± 0.5mm, 210mm ± 0.5mm, 230mm ± 0.5mm

            ③ Silicon wafer thickness: 120 μ m---180 μ m

            ④ Left and right directionality: matching the operation directionality with the cleaning machine

            ⑤ Applicable cleaning baskets: 100, 104, 113, 120 flower baskets

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