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            About Nanya

            About Nanya

            Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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            News

            News

            Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

            Detail
            Talent recruitment

            Talent recruitment

            Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

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            Contact Us

            Contact Us

            Wuxi Nanya Technology Co., Ltd., founded in 1996, is a high-tech enterprise integrating R&D, manufacturing and sales. It is located on the beautiful shore of the Taihu Lake Lake.

            Detail
            TAC-5000 fully automatic silicon wafer insertion machine

            Product Introduction

            The slicing mechanism of this device can evenly separate silicon wafers in any state, including those fully bonded with mortar; The technology has been applied for a utility model;

            Silicon wafer strip separation principle: This component is the core technology of the device, successfully developed by South Asia and has applied for two inventions. We abandon the conventional method of directly absorbing silicon wafers and instead use water absorption (there is always a certain distance between the silicon wafers and the conveyor belt), so that the separated silicon will move towards the conveyor belt in a non-contact manner along the direction of water flow, without any damage to the silicon wafers. At the same time, this technology has laid the foundation for the use of fully automatic chip insertion machines for ultra-thin (<140mm) silicon wafers, and thick and thin silicon wafers can use the same equipment;


            Performance and technical parameters
            Process characteristics
            Control system
            Fragment detection system
            Layout Plan of Insertion Machine
            Main component configuration
            Technical support and service requirements

            1. Overall dimensions     2220L×1120W×1850H(mm)

            2. Flower basket specifications     50, 25 pieces

            3. Silicon wafer size     125mm、156mm

            4. Wafer thickness     140~200um   

            5. Suitable for silicon wafers     Monocrystalline silicon, Polycrystalline silicon

            6. Production capacity     > 5000 tablets/hour

            7. Fragmentation rate        <0.2%

            8. Control system     PLC programmable controller, AC servo system

            9. Pressure            0.4~0.5Mpa drying gas

            10. Air source flow rate   Intake pipe diameter≥8mm

            11.Power supply           AC220V(Single phase three wire)、50HZ

            12. Power   2.5KW

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